News Release

Materials and Solidification (English Edition) Issue 3, 2025 officially released—call for papers now open!

Peer-Reviewed Publication

Tsinghua University Press

We are delighted to announce the official release of Issue 3, 2025 of Materials and Solidification, an international academic journal published by Tsinghua University Press and academically supported by the State Key Laboratory of Solidification Processing at Northwestern Polytechnical University (NPU). Professor Jinshan Li from NPU serves as the Editor-in-Chief, with Professor Junjie Wang as the Executive Editor-in-Chief. Dedicated to providing a high-level academic exchange platform for researchers and engineering experts worldwide, the journal aims to promote advancements in solidification theory, material design, microstructure evolution, and process innovation.

 

This issue showcases cutting-edge research across key topics in materials and solidification, including:

REVIEW

Advanced protection strategy of lithium metal anodes by Yunchong Feng, Hongbo Ding, Xinliang Li

 

RESEARCH ARTICLE

Synthesis and characterization of Ti₃C₂Tₓ MXene with preserved MAX phase structure via optimized delamination by Asma Eskandarli, Mohammad Khazaei, Mohammad Reza Mohammadizadeh

 

Interface mobility in massive transformation by Feng Liu, Haiyu Liu, Yongchang Liu

 

Effect of vacuum infiltration time on the properties of silica-based ceramic cores prepared by selective laser sintering combined with vacuum infiltration (9580016) by Heng Liu, Zhi-Cong Luo, Han-Di Liu, Jia-Min Wu, Chun-Ze Yan, Lin Guo, Shi-Feng Wen, Chao-Yue Chen, Zhong-Ming Ren, Yu-Sheng Shi

 

Atomic-scale insights into two-stage nucleation and microstructure evolution in cobalt solidification (9580017) by Changyao Ma, Chen Yang, Jiahang Wang, Junqin Shi, Bin Zhao, Zhenwu Ning, Xiaoli Fan

 

Journal Overview

Materials and Solidification focuses on frontier research outcomes in solidification theory and technology. It publishes original research on the solidification of bulk or thin-film materials—including metals, semiconductors, organics, inorganics, and polymers. Coverage extends to solidification processing (e.g., casting, welding, additive manufacturing) and non-equilibrium solidification phenomena in multi-physical fields (e.g., electric, ultrasonic, magnetic, microgravity environments).

Journal Homepage: https://www.sciopen.com/journal/3078-7955

Submission Portal: http://mc03.manuscriptcentral.com/msolid

Editorial Emails: matersolid@tup.tsinghua.edu.cn; Mater&Solid@nwpu.edu.cn

 

Key Features

  • China’s first international academic journal dedicated to the experiment, theory, and applications of material solidification.
  • Fully Open Access (OA) publication via SciOpen’s independent platform, edited and published by Tsinghua University Press.
  • Three issues published in 2025, with continuous call for papers.
  • APC Waiver: No Article Processing Charge for submissions received between January 1, 2026, and December 31, 2026.

 

Call for Papers

We welcome submissions of frontier research in solidification theory and technology, as well as innovative, interdisciplinary studies with novel ideas, theories, and methods. Manuscripts presenting new discoveries, critical thinking, and profound insights in the field are highly encouraged. All submissions undergo rigorous peer review to ensure the highest academic standards.

 

Accepted Article Types

Review, Concept, Research Article, Short Communication, Comment and Reply

 

For Inquiries

For academic questions during submission, please contact Executive Editor-in-Chief Professor Junjie Wang via email: wang.junjie@nwpu.edu.cn

 

Join the global community of materials scientists and engineers in advancing solidification research—submit your work to Materials and Solidification today!


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