Figure 2: Impact of PDMS Curing Temperature on SlipChip Sealing Strength. (IMAGE)

Toyohashi University of Technology (TUT)

Figure 2: Impact of PDMS Curing Temperature on SlipChip Sealing Strength.

Caption

This graph illustrates the maximum pneumatic pressure (rupture pressure in kPa) that PDMS SlipChip devices can withstand. Devices were cured at various temperatures (50°C to 120°C) and lubricated with 120 mPa·s silicone oil. The test, using a Rhodamine solution, shows that lower curing temperatures (e.g., 50°C) result in significantly higher sealing strength.

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COPYRIGHT（C）TOYOHASHI UNIVERSITY OF TECHNOLOGY. ALL RIGHTS RESERVED.

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