Cooling mechanism by two-phase immersion (IMAGE) Japan Science and Technology Agency Caption Combination of the grooved heat transfer surface with the lotus copper with high thermal conductivity leads to both the enhancement of boiling heat transfer and the prevention of a film boiling (limit of the boiling heat transfer) (a) Lotus-root-like porous metal with unidirectional pore structure (b) Self liquid supply from the top of the lotus copper is induced by vapor discharge from the grooves Credit Lotus Thermal Solution Usage Restrictions The image only be used with “Provided by Lotus Thermal Solution Inc. License Original content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.