Disaster waste from earthquakes and tsunamis can severely delay recovery in coastal communities, but existing predictive models often ignore how damaged transportation networks can hinder waste disposal efforts. In a recent study, researchers developed a probabilistic framework that jointly models waste disposal and road network systems under seismic and tsunami hazards. By accounting for their interdependencies and restoration dynamics, the framework offers more realistic estimates of cleanup times and highlights key strategies to improve resilience.

A new study led by researchers at the Universities of Oxford, Cambridge and Manchester has achieved a major advance in quantum materials, developing a method to precisely engineer single quantum defects in diamond—an essential step toward scalable quantum technologies. The results have been published in the journal Nature Communications.

Soft electronics, which are designed to function under mechanical deformation (such as bending, stretching, and folding), have become essential in applications like wearable electronics, artificial skin, and brain-machine interfaces. Crystalline silicon is one of the most mature and reliable materials for high-performance electronics; however, its intrinsic brittleness and rigidity pose challenges for integrating it into soft electronics. Recent research has focused on overcoming these limitations by utilizing structural design techniques to impart flexibility and stretchability to Si-based materials, such as transforming them into thin nanomembranes or nanowires. This review summarizes key strategies in geometry engineering for integrating crystalline silicon into soft electronics, from the use of hard silicon islands to creating out-of-plane foldable silicon nanofilms on flexible substrates, and ultimately to shaping silicon nanowires using vapor–liquid–solid or in-plane solid–liquid–solid techniques. We explore the latest developments in Si-based soft electronic devices, with applications in sensors, nanoprobes, robotics, and brain-machine interfaces. Finally, the paper discusses the current challenges in the field and outlines future research directions to enable the widespread adoption of silicon-based flexible electronics.