First 2D semiconductor FPGA achieves wafer-scale integration
Peer-Reviewed Publication
Updates every hour. Last Updated: 21-Dec-2025 03:11 ET (21-Dec-2025 08:11 GMT/UTC)
Researchers at Fudan University have achieved a breakthrough by fabricating the first Field-Programmable Gate Array (FPGA) based on wafer-scale two-dimensional (2D) semiconductor materials. Integrating approximately 4,000 transistors, the chip represents a historical leap, moving 2D electronics from simple logic circuits to complex, reconfigurable functional systems. Critically, the 2D FPGA exhibits inherent radiation resistance, maintaining full functionality after enduring a total ionizing dose of 10 Mrad of gamma-ray irradiation, offering a physically superior core device for strategic sectors like aerospace and high-reliability computing.
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