Scientists developed a high-entropy hydrogel that stiffens 760-fold when heated and softens in 28 seconds upon cooling. This innovation overcomes slow recovery in thermal-stiffening materials, unlocking applications in adaptive armor and soft robotics.

A novel lensless imaging technique, utilizing a programmable Fresnel zone aperture, offers high-resolution, artifact-free imaging with compact, cost-effective hardware. This method enhances resolution by 2.5 times and improves the signal-to-noise ratio by 3 dB compared to traditional approaches. The system's adaptability between static and dynamic modes enables diverse applications, from biomedical imaging to virtual reality and human-computer interaction, paving the way for miniaturized and multifunctional imaging platforms.

How gravity causes a perfectly spherical ball to roll down an inclined plane is part of elementary school physics canon. But the world is messier than a textbook.   

Scientists in the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) have sought to quantitatively describe the much more complex rolling physics of real-world objects. Led by Professor L. Mahadevan, they combined theory, simulations, and experiments to understand what happens when an imperfect, spherical object is placed on an inclined plane.

FAMU-FSU College of Engineering researchers have created a new method for studying protein degradation within immune cells that uses engineered microparticles to track and analyze degradation processes more effectively than traditional methods.

The work, which was published in ACS Applied Materials & Interfaces, has important implications for treating diseases such as cancer, Alzheimer’s disease and autoimmune disorders.

A team of researchers from Arizona State University, the U.S. Army Research Laboratory (ARL), Lehigh University and Louisiana State University has developed a groundbreaking high-temperature copper alloy with exceptional thermal stability and mechanical strength.

The research team’s findings on the new copper alloy, published in prestigious journal Science, introduce a novel bulk Cu-3Ta-0.5Li nanocrystalline alloy that exhibits remarkable resistance to coarsening and creep deformation, even at temperatures near its melting point.